ISIT

Call For Papers

The ICTMEM bridges the gap between academia and industry by promoting research with practical applications. It provides a platform for professionals and researchers to share insights that drive real-world impact.

The conference focuses on Heat Transfer, encouraging applied research, case studies, and industry-driven innovations.

Authors are invited to submit papers addressing, but not limited to, the following areas:

Thermal management in microdevices
Heat dissipation techniques in electronics
Innovative cooling solutions for devices
Thermal interface materials and applications
Thermal performance of electronic components
Modeling thermal behavior in microdevices
Heat transfer in semiconductor devices
Thermal cycling effects on electronics
Nano-coatings for thermal management
Thermal management in wearable technology
Heat sinks design and optimization
Thermal simulations for electronic systems
Thermal energy storage in microdevices
Smart thermal management systems
Thermal challenges in IoT devices
Heat transfer in high-density packaging
Thermal reliability of electronic systems
Cooling strategies for high-performance computing
Thermal effects on battery performance
Emerging trends in thermal management

Evaluation

Submissions will be evaluated based on applicability, innovation, and research contribution. Accepted papers will be presented and considered for publication in relevant journals and proceedings.

Registration

Complete your registration to participate in discussions that bridge academia and industry, and gain exposure to practical insights.

Publication

Selected papers will be considered for publication platforms that support academic and industry collaboration.

Submit Your Paper Now Confirm Your Participation Today

HYBRID EVENT: You can participate in person at Zurich, Switzerland or Virtually from your home or work

Information

Call For Papers

Evaluation

Registration

Publication

QUICK LINKS

ORGANIZER

ISIT

Email : info@isit.org.in

Phone : +1 7178835943