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Call For Papers

The IC-EPAE bridges the gap between academia and industry by promoting research with practical applications. It provides a platform for professionals and researchers to share insights that drive real-world impact.

The conference focuses on Electrical and Electronics Engineering, encouraging applied research, case studies, and industry-driven innovations.

Authors are invited to submit papers addressing, but not limited to, the following areas:

  • Advancements in electronics packaging technologies
  • Thermal management in electronics packaging
  • Reliability testing for electronic assemblies
  • Sustainable practices in electronics packaging
  • Integration of IoT in packaging systems
  • Challenges in electronics assembly processes
  • Quality control in electronics packaging
  • Emerging materials for electronics packaging
  • Design considerations for electronic assemblies
  • Automation in electronics manufacturing
  • Future trends in electronics packaging
  • Supply chain management for electronics assembly
  • Impact of 5G on electronics packaging
  • Electromagnetic compatibility in packaging
  • Case studies in electronics packaging engineering
  • Packaging solutions for wearable electronics
  • Robustness of electronic assemblies
  • Testing methodologies for electronics packaging
  • Industry standards for electronics packaging
  • Research directions in electronics assembly

Evaluation

Submissions will be evaluated based on applicability, innovation, and research contribution. Accepted papers will be presented and considered for publication in relevant journals and proceedings.

Registration

Complete your registration to participate in discussions that bridge academia and industry, and gain exposure to practical insights.

Publication

Selected papers will be considered for publication platforms that support academic and industry collaboration.